this is information on a product in full production. january 2013 doc id 15511 rev 3 1/9 9 HDMIULC6-4F3 4-line, ultralarge bandwhith esd protection datasheet ? production data features 4-line 15 kv esd protection ultralow line capacitance: 1.1 pf ultralarge bandwidth ? no influence on signal rise and fall times ? maximized number of signal harmonics flow-through layout with type c hdmi? connector low pcb space area: 1.76 mm2 footprint very low leakage current 70 na 0.4 mm pitch flip-chip package (wafer level csp) to minimize parasitic inductances rohs compliant complies with the standards: iec 61000-4-2 level 4 ? 15 kv (air discharge) ? 8 kv (contact discharge) applications mobile phones hdmi ports at 1.65 gb/s and up to 3.2 gb/s usb 2.0 ports up to 480 mb/s (hi-speed) video line protection tm : ipad is a trademark of stmicroelectronics. hdmi, the hdmi logo and high-definition multimedia interface are trademarks or registered trademarks of hdmi licensing llc. figure 1. pin configuration (bump side) description the HDMIULC6-4F3 is a monolithic, application specific discrete device dedicated to esd protection of the hdmi connection. it also offers the same high level of protection for ieee 1394a and ieee 1394b/c, usb 2.0, ethernet links, and video lines. its ultrahigh cutoff frequency (7 ghz) secures a high level of signal integrity. the device topology provides this integrity without compromising the complete protection of ics against the most stringent esd strikes. flip chip (top view) 10 bumps d in_ 1+ d in_ 1- d in_ 2+ d in_ 2- d out_ 1+ gnd gnd d out_ 1- d out_ 2+ d out_ 2- 3 21 a d b e c f d out = connector side www.st.com
characteristics HDMIULC6-4F3 2/9 doc id 15511 rev 3 1 characteristics figure 2. internal circuit schematic (top view) table 1. absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp esd discharge iec 61000-4-2 air discharge contact discharge 15 8 kv p pp peak pulse power dissipation (8/20 s) 35 w t j maximum junction temperature 125 c t stg storage temperature range -55 to + 150 c table 2. electrical characteristics (t amb = 25 c) symbol parameter test condition min. typ. max. unit v br breakdown voltage between vbus and gnd i r = 1 ma 6 v i rm leakage current v rm = 3 v 70 na c i/o-gnd (1) 1. c i/o-gnd values are given per line and relative to one gnd. capacitance between i/o and gnd v line = 0 v, v osc = 30 mv, f = 1 mhz 1.1 1.4 pf ? c i/o-gnd (1) capacitance variation between i/o and gnd v line = 0 v, v osc = 30 mv, f = 1 mhz between two lines of the same lane 0.06 pf bw bandwidth - 3 db 5.3 ghz
HDMIULC6-4F3 characteristics doc id 15511 rev 3 3/9 figure 7. short pulse measurements (typical value) figure 3. attenuation measurements figur e 4. analog crosstalk measurements db 100k 1m 10m 100m 1g 10g -10 -9 -8 -7 -6 -5 -4 -3 -2 -1 0 i2 - o2 f (hz) 100k 1m 10m 100m 1g 10g - 120 - 110 - 100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 f/hz i2 - o3 db f (hz) figure 5. +8 kv esd response (typical value) figure 6. -8 kv esd response (typical value) 20 v/div 122.9 v 22.8 v 17.9 v 6v 20 ns/div v : esd peak voltage v :clamping voltage @ 30 ns v :clamping voltage @ 60 ns pp cl cl v :clamping voltage @ 100 ns cl 1 1 2 2 3 4 4 3 20 v/div -88.9 v 3.3 v -8.6 v -6.9 v 20 ns/div v : esd peak voltage v :clamping voltage @ 30 ns v :clamping voltage @ 60 ns pp cl cl v :clamping voltage @ 100 ns cl 1 1 2 2 3 4 4 3 0 5 10 15 20 25 0 5 10 15 20 25 30 reverse forward v cl (v) i pp (a)
typical application schematic HDMIULC6-4F3 4/9 doc id 15511 rev 3 2 typical application schematic figure 8. implementation with hdmi type c connector (mobile phone) (tv, flat panel, monitor, projector) multimedia controller multimedia controller gnd tx2+ tx1- gnd tx1+ tx0- gnd tx0+ tc- gnd tc+ cec scl sda hpd gnd tx2+ tx1- gnd tx1+ tx0- gnd tx0+ tc- gnd tc+ cec scl sda hpd video audio ctrl / status video audio ctrl / status v dd _5v v dd _5v type c connector pin - out type c connector pin - out hdmiulc6 - 4f3 hdmi05 - cl02f3 host (mobile phone) display (tv, flat panel, monitor, projector) multimedia controller multimedia controller gnd tx2+ tx1- gnd tx1+ tx0- gnd tx0+ tc - gnd tc+ cec scl sda hpd gnd tx2+ tx1- gnd tx1+ tx0- gnd tx0+ tc - gnd tc+ cec scl sda hpd video audio ctrl / status video audio ctrl / status v dd _5v v dd _5v type c connector pin - out type c connector pinout hdmiulc6 - 4f3 hdmi05 - cl02f3 5v hpd HDMIULC6-4F3 b2 d3 d1 c3 c1 a1 a3 f1 f3 100k 4 tmds channel hdmi05-cl02f3 cec 5v scl 2 x 1k75 sda tmds data2 shield tmds data1 shield tmds data0 shield tmds clk shield tmds data2 + tmds data2 - tmds data1 + tmds data1 - tmds data0 + tmds data0 - tmds clk + tmds clk - ddc / eec ground cec scl sda reserved +5v power hot plug detect j4 1 2 3 4 5 7 8 9 10 11 12 13 14 16 17 18 19 6 15 27k vdd_cec e2 HDMIULC6-4F3 d3 d1 c3 c1 a1 a3 f1 f3 b2 e2 5v hpd HDMIULC6-4F3 b2 d3 d1 c3 c1 a1 a3 f1 f3 100k 4 tmds channel hdmi05-cl02f3 cec 5v scl 2 x 1k75 sda tmds data2 shield tmds data1 shield tmds data0 shield tmds clk shield tmds data2 + tmds data2 - tmds data1 + tmds data1 - tmds data0 + tmds data0 - tmds clk + tmds clk - ddc / eec ground cec scl sda reserved +5v power hot plug detect j4 1 2 3 4 5 7 8 9 10 11 12 13 14 16 17 18 19 6 15 27k vdd_cec e2 HDMIULC6-4F3 d3 d1 c3 c1 a1 a3 f1 f3 d3 d1 c3 c1 a1 a3 f1 f3 b2 e2 b2 e2 hdmi tx2- tx2- gnd gnd
HDMIULC6-4F3 layout recommendations doc id 15511 rev 3 5/9 3 layout recommendations figure 9. layout recommendations 4 ordering information scheme figure 10. ordering information scheme pcb routing: ?tmds routing on layer 3 ?gnd plane on layers 1 and 5 ?opening on layers 2 and 4 or ?everything on top layer ? opening on layer 2 and gnd on layer 3. hdmi type c connector hdmi ulc 6 4 f3 - application ultra-low capacitance breakdown voltage number of lines package hdmi = hdmi type protection 6 = 6 volts minimum 4 = 4 lines f3 = flip chip, 0.4 mm pitch
package information HDMIULC6-4F3 6/9 doc id 15511 rev 3 5 package information i n order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 11. package dimensions 400 m 1600 m 40 346 m 400 m 200 m 255 m 605 m 55 1100 m 40 figure 12. footprint recommendations figure 13. marking 220 m recommended 220 m recommended 260 m maximum solder stencil opening: copper pad diameter: solder mask opening: 300 m minimum x y x w z w dot, st logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) ecopack ? grade
HDMIULC6-4F3 package information doc id 15511 rev 3 7/9 figure 14. flip-chip tape and reel specifications user direction of unreeling all dimensions in mm 4.0 0.1 8.0 0.3 4.0 0.1 1.75 0.1 3.5 - 0.1 ? 1.5 0.1 0.69 0.05 1.21 0.05 1.67 0.05 st e xxz yww st e xxz yww st e xxz yww dot identifying pin a1 location
ordering information HDMIULC6-4F3 8/9 doc id 15511 rev 3 6 ordering information table 3. ordering information 7 revision history table 4. document revision history order code marking package weight base qty delivery mode HDMIULC6-4F3 ep flip chip 2.2 mg 10000 tape and reel (7?) date revision changes 24-mar-2009 1 first issue. 10-sept-2009 2 removed ?electrical characteristics, parameters? table.updated ta b l e 2. and table 3. updated figure 18.added dimension in figure 19. 15-jan-2013 3 updated features, table 1. , table 2. ,and table 3. updated esd curves and added figure 3. , figure 4. and figure 7.
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